PS3 GPU
Specifications
550 MHz on 90 nm process (shrunk to 65 nm in 2008[4] and to 40 nm in 2010[5])
Based on NV47 Chip (Nvidia GeForce 7800 Architecture)
300+ million transistors
Multi-way programmable parallel floating-point shader pipelines
Independent pixel/vertex shader architecture
24 parallel pixel-shader ALU pipes clocked @ 550 MHz
5 ALU operations per pipeline, per cycle (2 vector4 , 2 scalar/dual/co-issue and fog ALU, 1 Texture ALU)[citation needed]
27 floating-point operations per pipeline, per cycle[citation needed]
8 parallel vertex pipelines @550 MHz
2 ALU operations per pipeline, per cycle (1 vector4 and 1 scalar, dual issue)[citation needed]
10 FLOPS per pipeline, per cycle[citation needed]
Floating Point Operations: 400.4 Gigaflops ((24 * 27 Flops + 8 * 10 Flops) * 550)
74.8 billion shader operations per second [(24 Pixel Shader Pipelines*5 ALUs*550 MHz) + (8 Vertex Shader Pipelines*2 ALUs*550 MHz)]
24 texture filtering units (TF) and 8 vertex texture addressing units (TA)
24 filtered samples per clock
Maximum texel fillrate: 13.2 GigaTexels per second (24 textures * 550 MHz)
32 unfiltered texture samples per clock, ( 8 TA x 4 texture samples )
8 Render Output units / pixel rendering pipelines
Peak pixel fillrate (theoretical): 4.4 Gigapixel per second
Maximum Z sample rate: 8.8 GigaSamples per second (2 Z-samples * 8 ROPs * 550 MHz)
Maximum Dot product operations: 56 billion per second (combined with Cell CPU)
128-bit pixel precision offers rendering of scenes with High dynamic range rendering (HDR)
256 MB GDDR3 RAM at 700 MHz
128-bit memory bus width
22.4 GB/s read and write bandwidth
Cell FlexIO bus interface
20 GB/s read to the Cell and XDR memory
15 GB/s write to the Cell and XDR memory
Support for PSGL (OpenGL ES 1.1 + Nvidia Cg)
Support for S3TC texture compression [6
xBox 360 GPU
Main article: Xenos (graphics chip)
While the first Xbox's graphics processing unit was produced by NVIDIA, the Xbox 360 had a chip designed by ATI called Xenos. The chip was developed under the name "C1" and "R500" was often used to refer to it.[2] The GPU package contains two separate silicon dies, each built on a 90 nm process with a clock speed of 500 MHz; the GPU proper, manufactured by TSMC and a 10 MB eDRAM daughter-die, manufactured by NEC. Thanks to the daughter die, the Xenos can do 4× FSAA, z-buffering, and alpha blending with no appreciable performance penalty on the GPU.[3] The GPU also houses additional capabilities typically separated into a motherboard chipset in PC systems, effectively replacing the northbridge chip. Microsoft added an aluminum heat sink to cool the GPU in systems manufactured prior to the second half of 2007. Microsoft then revised the GPU heat sink in order to better move heat away from the GPU die.